Hyper Very Low Profile Copper Foil ho an'ny nomerika haingam-pandeha
●Ultra low profile miaraka amin'ny tanjaky ny peel avo sy ny fahaizana etch tsara
●Mampiasà teknolojia ambany coarsening, ny microstructure dia mahatonga azy io ho fitaovana tsara ampiasaina amin'ny fifindran'ny fifindran'ny matetika
●Ny foil voatsabo dia mavokely
●Circuit fampitana matetika matetika
●Tobim-piantsonana/Server
●Haingam-pandeha nomerika
●PPO/PPE
| Fisokajiana | Unit | Fomba fitsapana | Test Method | |||
| Nominal hateviny | Um | 12 | 18 | 35 | IPC-4562A | |
| Lanja faritra | g/m² | 107±5 | 153±7 | 285±10 | IPC-TM-650 2.2.12.2 | |
| fahadiovana | % | ≥99.8 | IPC-TM-650 2.3.15 | |||
| fahombiazana | Sisiny mamirapiratra (Ra) | սm | ≤0.43 | ≤0.43 | ≤0.43 | IPC-TM-650 2.3.17 |
| Lafiny matte (Rz) | um | 1.5-2.0 | 1.5-2.0 | 1.5-2.0 |
| |
| Faharetana amin'ny sintona | RT(23°C) | Mpa | ≥300 | ≥300 | ≥300 | IPC-TM-650 2.4.18 |
| HT(180°C) | ≥180 | ≥180 | ≥180 |
| ||
| Elongation | RT(23°C) | % | ≥5 | ≥6 | ≥8 | IPC-TM-650 2.4.18 |
| HT(180°C) | ≥6 | ≥6 | ≥6 |
| ||
| Pinholes & Porosity | isa | No | IPC-TM-650 2.1.2 | |||
| Pherin'adina | N/mm | ≥0.6 | ≥0.8 | ≥1.0 | IPC-TM-650 2.4.8 | |
| Lbs/in | ≥3.4 | ≥4.6 | ≥5.7 | |||
| MANOHITRA-oxidization | RT(23°C) | Andro | 90 |
| ||
| RT(200°C) | minitra | 40 | ||||
